https://www.matec-conferences.org/articles/matecconf/ref/2019/35/matecconf_cmm18_02002/matecconf_cmm18_02002.html
Probabilistic methodology for reliability assessment of electronic packages | MATEC Web of...
MATEC Web of Conferences, open access proceedings in Materials science, Engineering and Chemistry
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https://imapsource.org/article/56128-investigating-stress-in-hybrid-electronic-packages-using-white-light-surface-profilometry/stats
Investigating Stress in Hybrid Electronic Packages Using White Light Surface Profilometry |...
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https://dspace.zcu.cz/items/8d7ee1d2-f696-4430-8514-1c7697fe25a3/full
The increasing importance of the thermal management for modern electronic packages
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https://research.polyu.edu.hk/en/publications/process-design-for-transfer-moulding-of-electronic-packages-using/
Process design for transfer moulding of electronic packages using a case-based reasoning approach...
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https://research.ibm.com/publications/highly-optimized-and-robust-calculation-of-signal-propagation-parameters-in-electronic-packages
Highly optimized and robust calculation of signal propagation parameters in electronic packages for...
Highly optimized and robust calculation of signal propagation parameters in electronic packages for ECTC 1993 by L. Efrat et al.
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https://resources.pcb.cadence.com/thermal-analysis/2021-the-influence-of-thermal-resistance-on-heat-transfer-and-thermal-management-in-electronic-packages
The Influence of Thermal Resistance on Heat Transfer and Thermal Management in Electronic Packages
The thermal resistance of an electronic package can be classified into three levels: the component level, package level, and system level. This article...
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https://strathprints.strath.ac.uk/59515/
Peridynamic wetness approach for moisture concentration analysis in electronic packages -...
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https://pure.lib.cgu.edu.tw/en/publications/thermal-deformation-measurements-and-predictions-of-map-bga-elect-3/
Thermal deformation measurements and predictions of MAP-BGA electronic packages - Chang Gung...
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https://experts.arizona.edu/en/publications/crack-initiation-and-growth-in-electronic-packages/
Crack initiation and growth in electronic packages - University of Arizona
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https://www.omo-ic.com/blog/2013-07/logic-packages-9504.html
Logic Packages | OMO Electronic
NXP Semiconductors introduces logic plastic packages. The ultra-compact packaging design is ideal for leading-edge portable handheld devices.
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https://www.premiumseatsusa.com/concerts/techno-electronic/rufus-du-sol/7757199?packages=true
VIP Packages for Rufus Du Sol tickets | TECHNO / ELECTRONIC | PremiumSeatsUSA.com
Rufus Du Sol VIP tickets offered by PremiumSeatsUSA.com. Also offering, Rufus Du Sol VIP Packages, Rufus Du Sol VIP travel packages and the Rufus Du Sol VIP...
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https://www.electronicdesign.com/technologies/power/power-supply/discrete-power-semis/article/21194195/mosfet-packages-offer-cooler-operation
MOSFET Packages Offer Cooler Operation | Electronic Design
Diodes Incorporated has announced the introduction of its first MOSFETs to be housed in the miniature DFN1212-3 package.
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