https://www.electronicdesign.com/technologies/industrial/boards/article/21751800/modules-available-in-micropga-packages
The 0.05 in.2 Few-Chip Modules (FCMs) feature a high circuit density in a low profile micro pin grid array (MicroPGA) package that offers low inductance for...
electronic designmodulesavailablepackages
https://www.electronicdesign.com/news/products/article/21753745/ceramic-packages-span-oc-48-to-oc-768-applicatons
An extensive line of SONET semiconductor packaging now spans sizes that can accommodate telecomm applications extending from OC-48 and OC-192 to R&D on the...
ceramicpackagesspanocapplicatons
https://www.electronicdesign.com/technologies/test-measurement/article/21205851/keysight-introduces-advanced-curve-tracer-packages
Santa Rosa, CA. Keysight Technologies has introduced three advanced curve tracer packages for its B1506A Power Device Analyzer. Designed to provide power...
curve tracerelectronic designkeysightintroducesadvanced
https://www.electronicdesign.com/technologies/industrial/boards/article/21756789/connector-modules-come-in-surface-mount-packages
Available for the first time in a surface-mount package, the belMag family of shielded RJ-45 connector modules have integrated magnetics for 10/100 BASE-T...
surface mountelectronic designconnectormodulescome
https://www.ansys.com/de-de/resource-center/white-paper/electrothermal-mechanical-stress-reference-design-flow-for-printed-circuit-boards
This paper presents a reference design flow for solving the electrical, thermal and mechanical challenges of a printed circuit board (PCB) using simulation...
mechanical stressreference designelectrothermalflowpcbs