https://ieeetv.ieee.org/repp/electromigration-failure-caused-by-interdiffusion-in-the-microbump-in-3d-ic
Electromigration Failure Caused by Interdiffusion between Al Trace and Cu Seed Layer in the...
https://research.ucc.ie/en/publications/quantum-well-intermixing-in-alingaas-qw-structures-through-the-in/
Quantum well intermixing in AlInGaAs QW structures through the interdiffusion of group III atoms -...
https://www.sintef.no/en/publications/publication/0198cc66122b-3f7ef6ff-7c04-4af9-a7a3-74dd6d374a7f/
High-temperature shear strength of solid-liquid interdiffusion (SLID) bonding: Cu-Sn, Au-Sn and...