https://research.ibm.com/publications/a-single-flexible-coldplate-cools-multiple-devices
A single flexible coldplate cools multiple devices for ITherm 2019 - IBM Research
A single flexible coldplate cools multiple devices for ITherm 2019 by Shurong Tian et al.
multiple devices
https://publica.fraunhofer.de/entities/event/27ebcaee-2826-4b74-8699-6cd83e1ba351
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)...
electronic systemsintersocietyconferencethermal
https://research.ibm.com/publications/impact-of-power-granularity-on-chip-thermal-modeling
Impact of power granularity on chip thermal modeling for ITherm 2006 - IBM Research
Impact of power granularity on chip thermal modeling for ITherm 2006 by Keivan Etessam-Yazdani et al.
https://research.ibm.com/publications/thermal-design-and-performance-of-300-mm-wafer-scale-system
Thermal Design & Performance of 300 mm Wafer Scale System for ITherm 2024 - IBM Research
https://research.ibm.com/publications/a-data-centre-air-flow-model-for-predicting-computer-server-inlet-temperatures
A data centre air flow model for predicting computer server inlet temperatures for ITherm 2017 -...
A data centre air flow model for predicting computer server inlet temperatures for ITherm 2017 by Raymond Lloyd et al.
https://www.ieee-itherm.net/
IEEE ITherm Conference – The Intersociety Conference on Thermal and Thermomechanical Phenomena in...