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4.8 WBZ35x Module Assembly Considerations
The WBZ35x module is assembled with an EMI shield to ensure compliance with EMI emission and immunity rules. The EMI shield is made of a tin-plated steel...
module assemblyconsiderations
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4.5 WBZ35x Module RF Considerations
The product design, environment and application significantly affect the overall performance of the system. The product designer must ensure system-level...
module rfconsiderations
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4.4 WBZ35x Module Routing Guidelines
Use the multi-layer host board for routing signals on the inner layer and the bottom layer. The top layer (underneath the module) of the host board must be...
moduleroutingguidelines
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4.3 WBZ35x Module Placement Guidelines
For any Bluetooth Low Energy/Zigbee product, the antenna placement affects the performance of the whole system. The antenna requires free space to radiate RF...
moduleplacementguidelines
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4.7 WBZ35x Module Reflow Profile Information
The WBZ35x Module was assembled using the IPC/JEDEC J-STD-020 standard lead-free reflow profile. The WBZ35x Module can be soldered to the host board using...
modulereflowprofileinformation
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4.6 WBZ35x Module Antenna Considerations
moduleantennaconsiderations