https://s-pack.org/publication/multi-level-embedded-three-dimensional-manifold-microchannel-heat-sink-of-aluminum-nitride-direct-bonded-copper-for-the-high-power-electronic-module/
Lin, Yujui*, Tiwei Wei*, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi...