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https://patents.searchlight.law/doc/US20260282892
US20260282892A1: SEMICONDUCTOR DIE STRUCTURE WITH AIR GAPS AND METHOD FOR PREPARING THE SAME |...
The present disclosure provides a semiconductor die structure including a substrate, a first supporting backbone, a first conductor block, and an air gap...
semiconductor dieair gapsthe samestructuremethod
https://www.waterregsuk.co.uk/topics/all-faqs/type-auk-1-air-gapsfaqs/
Water Regs UK Limited - Type AUK 1 air gaps
limited typeair gapswaterregsauk