https://www.3dincites.com/2011/01/invensas-acquires-allvia-3d-ic-packaging-technology/
Invensas Acquires ALLVIA 3D-IC Packaging Technology - IMAPS 3D InCites Content Platform
Sep 9, 2023 - Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. , announced today that it has acquired the patent assets of ALLVIA, Inc. In...
ic packagingacquiresallvia