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https://www.nxp.com/packages/SOT774-2
SOT774-2: LBGA208Low Profile Ball Grid Array | NXP Semiconductors
Through-hole mounting dual power transistor package with 6 leads in a low-profile format for high power density applications
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https://www.elepcb.com/hu/blog/ball-grid-array-guide-to-bga-packages/
A Ball Grid Array (BGA) csomagok útmutatója
Dec 26, 2024 - Fedezze fel az olyan BGA típusokat, mint a kerámia és a finom osztású BGA-k, valamint az elektronika számára nyújtott elképesztő előnyeiket. Tudja meg, mely...
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https://www.cqvip.com/doc/journal/00164JH34JD8BJP36PDO6JP16PDO6J50PY?sign=9b5f05d9575a18bb99d1b2937afdc2c6c11fed6689e19847abe372cd55b7739e&expireTime=1805061913292&resourceId=00164JH34JD8BJP36PDO6JP16PDO6J50PY&type=1
Ball grid array and flip chip technologies: their histories and prospects-文献详情-维普官网
Integration levels in semiconductors have long been a driving force in electronic packaging, forcing smaller and smaller spacings on peripherally leaded...
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