https://www.nxp.com/packages/SOT1707-1
SOT1707-1: LBGA740Low Profile Ball Grid Array | NXP Semiconductors
Surface-mount LFPAK56D power package with dual source pins and exposed die pad for enhanced thermal performance in automotive applications
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https://www.epo.org/en/boards-of-appeal/decisions/t011103eu1
T 1103/01 (Ball grid array/STMICROELECTRONICS) of 01.12.2003
ball grid array110301stmicroelectronics12
https://www.nxp.com/packages/SOT2026-1
SOT2026-1: FBGA957Fine-pitch Ball Grid Array | NXP Semiconductors
Surface mount package details for NXP's SOT2026-1 ultra-thin-profile leadless package with 12 terminals and 2x2mm footprint for power applications
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https://www.thebusinessresearchcompany.com/report/ball-grid-array-bga-packaging-global-market-report
Ball Grid Array (BGA) Packaging Market Report 2026, Share, Growth
Global Ball Grid Array (BGA) Packaging market size is expected to reach $11.53 Billion by 2030 at 5.1%, expansion of consumer electronics driving growth of the...
ball grid arraymarket reportbgapackaging2026
https://www.nxp.com/packages/SOT2051-1
SOT2051-1: FBGA548Fine-pitch Ball Grid Array | NXP Semiconductors
Small-footprint 16-lead LFBGA package with 0.5mm pitch for highly integrated SoC devices requiring minimal PCB space and low-profile mounting
ball grid array1pitchnxpsemiconductors
https://www.nxp.com/packages/SOT1840-6
SOT1840-6: FBGA621Fine-pitch Ball Grid Array | NXP Semiconductors
Miniature 6-pin SOT package with exposed pad offers high thermal performance and small footprint for power-efficient designs and space-critical applications
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https://www.nxp.com/packages/SOT1717-1
SOT1717-1: FBGA529Fine-pitch Ball Grid Array | NXP Semiconductors
Surface mount plastic package with leads, optimized for power semiconductor devices with high thermal dissipation up to 250W
ball grid array1pitchnxpsemiconductors
https://www.nxp.com/packages/SOT2130-1
SOT2130-1: FBGA400Fine-pitch Ball Grid Array | NXP Semiconductors
Advanced footprint and mechanical drawings for SOT2130-1 package, with pad dimensions and PCB design specifications for NXP semiconductors
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