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https://www.nxp.com/packages/SOT1833-1 SOT1833-1: WLCSP75Wafer Level Chip-size Package | NXP Semiconductors Small outline 3.0 x 3.0 mm HVQFN package with 20 terminals and exposed pad optimized for high current density and thermal performance chip size package 1 level nxp semiconductors https://www.nxp.com/packages/SOT1914-1 SOT1914-1: WLCSP56Wafer Level Chip-size Package | NXP Semiconductors Surface-mount leadless 8-terminal TSLP package with 1.2 x 1.3 x 0.55 mm body and 0.35 mm pitch for compact low-profile integrated circuit designs chip size package 1 level nxp semiconductors https://www.nxp.com/packages/SOT1379-4 SOT1379-4: WLCSP6Wafer Level Chip-size Package | NXP Semiconductors Surface mount package with 56 leads, 1.6mm pitch, 16.4x18.4mm body size and 0.5mm terminal height for automotive microcontrollers chip size package 4 level nxp semiconductors https://www.nxp.com/packages/SOT1401-1 SOT1401-1: WLCSP25Wafer Level Chip-size Package | NXP Semiconductors Surface mount plastic package with dual side cooling capability and exposed die pad for high power applications up to 10 W dissipation chip size package 1 level nxp semiconductors https://www.nxp.com/packages/OL-PMCM440VNE OL-PMCM440VNE: WLCSPWafer Level Chip-size Package | NXP Semiconductors Through-hole 8-pin plastic power module package with exposed die pad for NXP PMCM440VNE automotive MOSFETs and power ICs chip size package ol level nxp semiconductors https://www.nxp.com/packages/SOT1393-2 SOT1393-2: WLCSP16Wafer Level Chip-size Package | NXP Semiconductors Lead-free plastic package with solderable side pads and multiple pins designed for high-density small footprint applications like mobile devices chip size package 2 level nxp semiconductors https://www.nxp.com/packages/SOT1397-4 SOT1397-4: WLCSP20Wafer Level Chip-size Package | NXP Semiconductors Complete mechanical specifications and design parameters for NXP's HSON6 package, featuring 0.6mm pitch and RoHS-compliant surface mount terminals chip size package 4 level nxp semiconductors https://www.nxp.com/packages/SOT1784-1 SOT1784-1: WLCSP89Wafer Level Chip-size Package | NXP Semiconductors Industry-standard 14-pin HVSON package with exposed pad delivers high thermal and electrical performance for automotive and industrial ICs chip size package 1 level nxp semiconductors https://www.nxp.com/packages/SOT2125-1 SOT2125-1: WLCSP79Wafer Level Chip-size Package | NXP Semiconductors WLCSP79, wafer level chip scale package, 79 terminals, 0.35 mm pitch, 3.58 mm x 3.185 mm x 0.37 mm body (backside coating included) chip size package 1 level nxp semiconductors https://www.nxp.com/packages/SOT1890-1 SOT1890-1: WLCSP56Wafer Level Chip-size Package | NXP Semiconductors Through-hole plastic surface-mount package with 28 terminals for high-performance computing and automotive applications, 0.65 mm pitch chip size package 1 level nxp semiconductors https://www.nxp.com/packages/SOT1459-8 SOT1459-8: WLCSP42Wafer Level Chip-size Package | NXP Semiconductors WLCSP42, wafer level chip scale package, 42 terminals, 0.4 mm pitch, 3.02 mm x 2.72 mm x 0.525 mm body (backside coating included) chip size package 8 level nxp semiconductors