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https://www.henkel.com/press-and-media/press-releases-and-kits/2022-08-09-henkel-and-citc-forge-partnership-to-accelerate-high-thermal-die-attach-solutions-1723612
Henkel and CITC forge partnership to accelerate high-thermal die attach solutions
Agreement aims to advance pressureless sintering material development for RF and power devices
henkelcitcforgepartnershipaccelerate
https://www.indium.com/applications/semiconductor-packaging-and-assembly/die-attach/
Die-Attach | Semiconductor Packaging & Assembly | Applications | Indium Corporation
Nov 3, 2025 - From high-temperature solder pastes to gold-based solders, discover Indium Corporation's die-attach solutions for high-power devices.
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