https://research.ibm.com/publications/flip-chip-assembly-method-employing-differential-heatingcooling-for-large-dies-with-coreless-substrates
Flip chip assembly method employing differential heating/cooling for large dies with coreless...
Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates for ECTC 2013 by Katsuyuki Sakuma et al.
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https://gala.gre.ac.uk/id/eprint/8784/
Greenwich Academic Literature Archive - Co-design/simulation of flip-chip assembly for high voltage...
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https://www.industryweek.com/expansion-management/industry-clusters/article/21936943/kyocera-america-doubles-flip-chip-assembly-capacity
Kyocera America Doubles Flip-Chip Assembly Capacity | IndustryWeek
New $3.5 million clean room in San Diego
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