https://publica.fraunhofer.de/entities/publication/55a1b03c-f50a-4768-91af-94613c493c88
Reliable wafer-level-bonding method for MEMS packaging using LTCC interposers
The anodic bonding of low temperature co-fired ceramics (LTCC) for the wafer-level-packaging of MEMS represents a cost efficient and highly reliable packaging...
mems packagingreliablewaferlevelbonding
https://bsac.berkeley.edu/publications/mems-microshells-microneedles-microscale-fluid-visualization-and-vacuum-packaging
MEMS Microshells for Microneedles, Microscale Fluid Visualization, and Vacuum Packaging of...
vacuum packagingmemsmicroneedlesmicroscale
https://repository.gatech.edu/entities/publication/9b055a11-a0e6-4b4c-8a5b-e9108c080d5e
Packaging and Characterization of MEMS Optical Microphones
Miniature microphones have numerous applications but often exhibit poor performance which can be attributed to the challenges associated with capacitive...
packagingcharacterizationmemsopticalmicrophones