https://www.electronicdesign.com/technologies/components/article/21793117/reworkable-adhesive-improves-thermal-performance-eliminates-underfill
Reworkable Adhesive Improves Thermal Performance, Eliminates Underfill | Electronic Design
The UA-2605 reworkable edgebond adhesive promises to improve thermal cycle performance of CBGAs and plastic BGAs.
thermal performanceadhesiveimproveseliminatesunderfill