underfill - Robuta Search

https://repository.gatech.edu/entities/publication/95ddf024-a300-4700-9e0c-ffd269f32c26 Moisture Absorption in Uncured Underfill Materials This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride [methylhexahydrophthalic anhydride... moisture absorption underfill materials https://repository.gatech.edu/entities/publication/3dfb6960-0633-46c2-9f66-087b3cc1c93f Fast-Flow Underfill Encapsulant: Flow Rate and Coefficient of Thermal Expansion In the flip-chip on board assembly method, an underfill encapsulant material is applied in the gap between the integrated circuit (IC) chip and substrate to... fast flow underfill encapsulant rate coefficient https://research.ibm.com/publications/high-performance-wafer-level-underfill-material-with-high-filler-loading High performance wafer level underfill material with high filler loading for ECTC 2011 - IBM... High performance wafer level underfill material with high filler loading for ECTC 2011 by Satoru Katsurayama et al. https://research.ibm.com/publications/advances-in-percolated-thermal-underfill-ptu-simulations-for-3d-integration Advances in percolated thermal underfill (PTU) simulations for 3D-integration for EuroSimE 2015 -... Advances in percolated thermal underfill (PTU) simulations for 3D-integration for EuroSimE 2015 by Sridhar Kumar et al. https://collaborate.princeton.edu/en/publications/errors-in-parallel-plate-and-cone-plate-rheometer-measurements-du/fingerprints/ Errors in parallel-plate and cone-plate rheometer measurements due to sample underfill -... in parallel https://repository.gatech.edu/entities/publication/bde7eaec-fdd2-488b-94ca-fd85abbfeeff Study and Characterization on the Nanocomposite Underfill for Flip Chip Applications The nanosilica filled composite is a promising material for the no-flow underfill in flip-chip application. However, as the filler size decreases into the nano... on the flip chip study characterization https://repository.gatech.edu/entities/publication/20df1539-f20b-4627-934b-0cba4308e382 Double-Layer No-Flow Underfill Process for Flip-Chip Applications No-flow underfill technology shows potential advances over the conventional underfill technology toward a low-cost flop-chip underfill process. However, due to... double layer flip chip flow underfill process https://yumse.synology.me/kcsolution/index.php?mid=board_free&sort_index=readed_count&order_type=desc&page=1&document_srl=1445295 Prof. Han, Joo-Hwan in MSE, YU - New Generation of Ultra High Tg Underfill https://yumse.synology.me/kcsolution/index.php?mid=board_free&sort_index=regdate&order_type=desc&page=1&document_srl=1445285 Prof. Han, Joo-Hwan in MSE, YU - Why Are HBM Manufacturers Choosing Liquid Mold Underfill?