https://www.izm.fraunhofer.de/en/abteilungen/system_integrationinterconnectiontechnologies/leistungsangebot/prozessdienstleistungenprototypen/assembly-of-microelectronic-components-on-flexible-and-rigid-substrates.html
Assembly of Microelectronic Components on Flexible & Rigid Substrates - Fraunhofer IZM
Biocompatible assembly and bonding of thinned chips
rigid substratesassemblymicroelectroniccomponentsflexible
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https://www.hu-berlin.de/en/forschungsinformationssystem/projekt-details/sfb-448-iii-manipulation-formstabiler-makromolekuele-auf-festkoerperoberflaechen-teilprojekt-a-11
SFB 448 III: Manipulation of rigid macromolecules on solid substrates (TP A 11) -...