https://www.nxp.com/packages/SOT1577-1
SOT1577-1: HSOP30Heatsink Small Outline Package | NXP Semiconductors
Small-outline transistor package specifications with mechanical data, dimensions and pad layout information for SOT1577-1 semiconductor package design
small outline package1nxpsemiconductors
https://www.nxp.com/packages/SOT1305-2
SOT1305-2: HSOP44Heatsink Small Outline Package | NXP Semiconductors
Ultra-compact SOT1305-2 leadless package with exposed die pad supports power-efficient solutions for high-performance mobile and IoT applications
small outline package2nxpsemiconductors
https://www.nxp.com/packages/SOT1578-1
SOT1578-1: HSOP36Heatsink Small Outline Package | NXP Semiconductors
Detailed technical specifications and mechanical drawings for NXP's SOT1578-1 package, featuring 12-lead HVSON dimensions and footprint guidelines
small outline package1nxpsemiconductors
https://www.nxp.com/packages/SOT1747-2
SOT1747-2: HSOP54Heatsink Small Outline Package | NXP Semiconductors
HSOP54, plastic, heatsink small outline package; W/B, tooth gap design, 54 terminals; 0.65 mm pitch; 4.6 mm x 10.4 mm exposed pad
small outline package2nxpsemiconductors