https://www.nist.gov/publications/superconformal-copper-deposition-through-silicon-vias-suppression-breakdown
The evolution of superconformal Cu electrodeposition in high aspect ratio through silicon vias (TSVs) is examined as a function of polymer suppressor concentrat
superconformalcopperdepositionsiliconvias
https://www.arxiv.org/abs/hep-th/0512085
Abstract page for arXiv paper hep-th/0512085: Boundary renormalisation group flows of unitary superconformal minimal models
renormalisation grouphepthboundaryflows
https://www.nist.gov/publications/superconformal-bottom-cobalt-deposition-high-aspect-ratio-through-silicon-vias
This work demonstrates void-free cobalt filling of 56 um tall, annual Through Silicon Vias (TSVs) using a mechanism that couples suppression breakdown and surfa
bottom upaspect ratiosuperconformalcobaltdeposition