Robuta

https://ui.adsabs.harvard.edu/abs/2011impa.conf...31L/abstract
Currently most LED components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging....
wafer level packagingadvancedledtechnologiesads
https://www.usherbrooke.ca/recherche/en/inventory-of-research-projects/project/1178?cHash=443c86e03fe913467e41296fefa6902c
wafer leveloptimizationmicrofabricationprocessfan