https://www.digitimes.com/news/a20200824PD203.html
TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021,...
tsmcpackagingdevelopmentremainfocused
https://www.digitimes.com/news/a20211025PD209.html
TSMC's newly-developed system-on-integrated-chips (SoIC) technology will be first adopted for AMD's multiple high-performance computing (HPC) chip series,...
amdadopttsmcsoichpc