https://www.nxp.com/packages/SOT1780-8
WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 3.9 mm x 1.9 mm x 0.525 mm body (backside coating included)
chip size packagenxp semiconductorslevel
https://www.usitc.gov/fed_reg_notices/section_337_notices/certain_semiconductor_chips_minimized_chip_package_030909.htm
The United States International Trade Commission is an independent, nonpartisan, quasi-judicial federal agency that fulfills a range of trade-related mandates....
chip packagecertainsemiconductorchipssize
https://www.nxp.com/packages/SOT1459-6
Leadless plastic package with 6 terminals optimized for small board footprints, reduced height, and enhanced thermal performance
chip size packagenxp semiconductorslevel