electromigration - Robuta Search

https://research.ibm.com/publications/driving-force-in-electromigration Driving force in electromigration for Physical Review B - IBM Research Driving force in electromigration for Physical Review B by Rolf Landauer et al. driving force physical review b research https://hackaday.com/tag/electromigration/ Electromigration | Hackaday hackaday https://research.ibm.com/publications/kirkendall-study-of-electromigration-in-thin-films Kirkendall study of electromigration in thin films for Thin Solid Films - IBM Research Kirkendall study of electromigration in thin films for Thin Solid Films by P.S. Ho et al. thin films kirkendall study https://research.ibm.com/publications/electromigration-and-current-carrying-implications-for-aluminum-based-metallurgy-with-tungsten-stud-via-interconnections Electromigration and current-carrying implications for aluminum-based metallurgy with tungsten... Electromigration and current-carrying implications for aluminum-based metallurgy with tungsten stud-via interconnections for SPIE Microelectronic Processing... current carrying implications https://research.ibm.com/publications/comparison-of-electromigration-in-cu-interconnects-with-atomic-layer-or-physical-vapor-deposited-tan-liners Comparison of electromigration in Cu interconnects with atomic-layer- or physical-vapor-deposited... Comparison of electromigration in Cu interconnects with atomic-layer- or physical-vapor-deposited TaN liners for JES by C.-K. Hu et al. https://research.ibm.com/publications/correlation-between-special-grain-boundaries-and-electromigration-behavior-of-aluminum-thin-films--1 Correlation between special grain boundaries and electromigration behavior of aluminum thin films... Correlation between special grain boundaries and electromigration behavior of aluminum thin films for Canadian Metallurgical Quarterly by K.T. Lee et al. https://scholars.cityu.edu.hk/en/publications/electromigration-in-flip-chip-solder-joints-having-a-thick-cu-col/ Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder... https://research.ibm.com/publications/electromigration-damage-in-aluminum-film-conductors--1 Electromigration damage in aluminum film conductors for IRPS 1970 - IBM Research Electromigration damage in aluminum film conductors for IRPS 1970 by M.J. Attardo et al. damage aluminum film https://iris.cnr.it/handle/20.500.14243/2545 Standard JEDEC JESD61A.01 Isothermal Electromigration Test Procedure standard jedec isothermal test procedure https://scholars.cityu.edu.hk/en/publications/diffusion-driven-evolution-of-morphology-in-metallic-joints-and-s/ Diffusion-driven evolution of morphology in metallic joints and solder balls at electromigration,... https://publikationen.bibliothek.kit.edu/110073206 Activation energy and prefactor for surface electromigration a... activation energy surface https://uwspace.uwaterloo.ca/items/016aaafa-7f56-4aee-9cd5-68720bda33a3 Simplifying Accelerated Electromigration Testing of Solder using Wire-based DUTs A novel and accelerated method for the characterization of Electromigration (EM) in a solder material typically used in electronics packaging is proposed in... simplifying accelerated testing solder using https://research.ibm.com/publications/electromigration-behavior-of-hot-sputtered-alcu-versus-chemical-vapor-deposition-w-vias Electromigration behavior of hot-sputtered Al(Cu) versus chemical vapor deposition W vias for... Electromigration behavior of hot-sputtered Al(Cu) versus chemical vapor deposition W vias for Journal of Vacuum Science and Technology B: Microelectronics and... https://research.vu.nl/en/publications/electromigration-of-hydrogen-in-alloys-evidence-of-unscreened-pro/ Electromigration of hydrogen in alloys: Evidence of unscreened proton behavior - Vrije Universiteit... hydrogen alloys https://shop.elsevier.com/books/electromigration-in-thin-films-and-electronic-devices/kim/978-1-84569-937-6 Electromigration in Thin Films and Electronic Devices - 1st Edition | Elsevier Shop thin films electronic devices https://www.ideals.illinois.edu/items/22749 Hierarchical electromigration reliability diagnosis for ULSI interconnects | IDEALS hierarchical reliability diagnosis ulsi interconnects https://scholars.cityu.edu.hk/en/publications/polarity-effect-of-electromigration-on-kinetics-of-intermetallic-/ Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free... https://research.ibm.com/publications/analysis-of-grain-boundary-electromigration Analysis of grain-boundary electromigration for Journal of Applied Physics - IBM Research Analysis of grain-boundary electromigration for Journal of Applied Physics by P.S. Ho applied physics analysis grain boundary https://pure.psu.edu/en/publications/nanometer-gaps-by-feedback-controlled-electromigration/ Nanometer gaps by feedback-controlled electromigration - Penn State by feedback nanometer gaps controlled penn https://research.ibm.com/publications/electromigration-cu-mass-flow-in-cu-interconnections Electromigration Cu mass flow in Cu interconnections for Thin Solid Films - IBM Research Electromigration Cu mass flow in Cu interconnections for Thin Solid Films by C.-K. Hu et al. mass flow https://iris.cnr.it/handle/20.500.14243/44763 Experimental assessment of electromigration properties of background electrolytes in capillary zone... experimental assessment properties background electrolytes https://research.ibm.com/publications/reduction-of-electromigration-in-aluminum-films-by-copper-doping Reduction of electromigration in aluminum films by copper doping for IBM J. Res. Dev - IBM Research Reduction of electromigration in aluminum films by copper doping for IBM J. Res. Dev by Irving Ames et al. https://research.ibm.com/publications/relationship-between-interfacial-adhesion-and-electromigration-in-cu-metallization Relationship between interfacial adhesion and electromigration in Cu metallization for Journal of... Relationship between interfacial adhesion and electromigration in Cu metallization for Journal of Applied Physics by M.W. Lane et al. https://infoscience.epfl.ch/entities/publication/9a7f6413-3437-414c-8351-20dc0b65a060/articledetails Liquid electromigration in gallium-based biphasic thin films Liquid metals have recently gained interest as a material of choice for soft and stretchable electronic circuits, thanks to their virtually infinite mechanical... liquid gallium based biphasic thin https://www.iue.tuwien.ac.at/news/article?tx_news_pi1%5Baction%5D=detail&tx_news_pi1%5Bcontroller%5D=News&tx_news_pi1%5Bnews%5D=177&cHash=9102471cfc86544a143fa037c6fc5f76 "A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the... Editor's Pick in Advancing Open Science comprehensive microstructure aware modeling framework https://publikationen.bibliothek.kit.edu/1000160554 Phase-field modelling of electromigration-induced intergranula... phase field modelling induced https://www.iue.tuwien.ac.at/phd/ceric/node32.html 4. Electromigration Problem in the Interconnect 4. Electromigration Problem in the Interconnect in the problem interconnect https://research.ibm.com/publications/electromigration-drift-velocity-in-al-alloy-and-cu-alloy-lines Electromigration drift velocity in Al-alloy and Cu-alloy lines for JES - IBM Research Electromigration drift velocity in Al-alloy and Cu-alloy lines for JES by C.-K. Hu et al. https://meetings-archive.aps.org/mar/2010/c1/125/ Fabrication of Nanoscale Devices by Electromigration - Possible suggestions for order parameter... Currently, transport properties through nanostructures are of considerable importance due to the increased demand for nanometer sized electronic devices. One of for order fabrication nanoscale devices https://infoscience.epfl.ch/entities/publication/9a7f6413-3437-414c-8351-20dc0b65a060 Liquid electromigration in gallium-based biphasic thin films Liquid metals have recently gained interest as a material of choice for soft and stretchable electronic circuits, thanks to their virtually infinite mechanical... liquid gallium based biphasic thin https://nrc-publications.canada.ca/eng/view/object/?id=2cf00b20-e0b8-45d8-8f5c-d4467becacff Removing charged species from porous archaeological material: diffusion, electromigration,... Removing charged species from porous archaeological material: diffusion, electromigration, electrophoresis and electro-osmosis in fully immersed objects removing charged species porous archaeological https://scholars.cityu.edu.hk/en/publications/electromigration-of-pb-free-solder-under-a-low-level-of-current-d/ Electromigration of Pb-free solder under a low level of current density - CityUHK Scholars https://impact.ornl.gov/en/publications/electromigration-in-eutectic-gold-tin-80au20sn-wt-solder-joints/ Electromigration in Eutectic Gold-Tin (80Au20Sn-wt%) Solder Joints - Oak Ridge National Laboratory https://research.ibm.com/publications/study-of-interfacial-reaction-and-electromigration-reliability-of-pb-free-solders-with-nickel-iron-barrier-layer Study of interfacial reaction and electromigration reliability of Pb-free solders with nickel iron... Study of interfacial reaction and electromigration reliability of Pb-free solders with nickel iron barrier layer for InterPACK 2011 by Minhua Lu et al. https://scholars.cityu.edu.hk/en/publications/electromigration-in-sn-pb-solder-strips-as-a-function-of-alloy-co/ Electromigration in Sn-Pb solder strips as a function of alloy composition - CityUHK Scholars https://research.ibm.com/publications/electromigration-in-gold-and-copper-thin-film-conductors Electromigration in gold and copper thin film conductors for Thin Solid Films - IBM Research Electromigration in gold and copper thin film conductors for Thin Solid Films by R.J. Miller et al. https://ieeetv.ieee.org/repp/electromigration-failure-caused-by-interdiffusion-in-the-microbump-in-3d-ic Electromigration Failure Caused by Interdiffusion between Al Trace and Cu Seed Layer in the... https://research.ibm.com/publications/relationship-between-interfacial-adhesion-and-electromigration-in-cu-metallization--1 Relationship between interfacial adhesion and electromigration in Cu metallization for IIRW 2002 -... Relationship between interfacial adhesion and electromigration in Cu metallization for IIRW 2002 by J.R. Lloyd et al. https://scholars.cityu.edu.hk/en/publications/electromigration-in-three-dimensional-integrated-circuits/ Electromigration in three-dimensional integrated circuits - CityUHK Scholars three dimensional integrated circuits scholars https://experts.umn.edu/en/projects/electromigration-lifetime-characterization-under-realistic-chip-o/ Electromigration Lifetime Characterization under Realistic Chip Operating Conditions -... lifetime characterization realistic chip operating https://meetings-archive.aps.org/dfd/2011/e18/5/ Electromigration dispersion: theory vs. experiment - Vortex Roll Breakup in Three-Dimensional... When the concentration of sample ions in zone electrophoresis is significant compared to that of the carrier electrolyte, axial variation of electrical conducti dispersion theory vs experiment